Technology

Thin film Printing allows the direct deposition of patterned layers which means only one equipment to perform :

  - Passivation layer deposition (Typically AlOx)

  - Capping layer deposition (SiNx, SiOx, TiOx)

  - Contact opening (already open in printed layers)

 

Based on Spatial Atomic Layer Deposition, the technology offers the following benefits :

  - Atmospheric pressure process (no load-lock

     systems)

  - High throughput (up to 1 nm/s)

  - Low temperature (< 300 °C)

  - High material quality (no particle, no pinhole)

  - Low maintenance (no coating on the machine

     walls)

 

Thin film Printers are modular equipments processing one wafer per printing head. R&D equipments have one printing head while production equipments combine multiple printing heads.

 

Thin film Printing of silicon solar cell rear-passivation layers

 

Rear-passivated solar cells (PERC) is a widely adopted improvement for solar cells based on p-type solar wafers.

 

However this improvement is expensive to implement as it requires two to three additional equipments for passivation layer deposition, capping layer deposition and contact opening.

 

Brochures

EnHelios NanoTech - SAS au capital de 45 000 € - 802 611 541 RCS Coutances - Contact : info@enhelios.com - Tel : +33 (0)6 07 35 35 42

170 rue Lysette Darsonval - 50000 - Saint Lô   &   6 impasse Jean Besson - 78 114 - Magny les Hameaux - France